A microsystem consists of microelectronic, optoelectronic, microwave, microelectromechanical and energy components interconnected. Thermal, electrical, fabrication and assembly issues for microsystems represented by iPhone series will be studied. The packaging and interconnection technologies used to establish the design and manufacturing infrastructure of microsystems will be reviewed. Other optoelectronic, MEMS and batter components for microsystems will also be studied. Same as MCEN 4010.