Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations
Journal Article
Overview
publication date
- February 1, 2015
has restriction
- green
Date in CU Experts
- December 8, 2017 2:46 AM
Full Author List
- Yang N; Luo T; Esfarjani K; Henry A; Tian Z; Shiomi J; Chalopin Y; Li B; Chen G
author count
- 9
citation count
- 55
published in
Other Profiles
International Standard Serial Number (ISSN)
- 1546-1955
Electronic International Standard Serial Number (EISSN)
- 1546-1963
Digital Object Identifier (DOI)
Additional Document Info
start page
- 168
end page
- 174
volume
- 12
issue
- 2