Thermal-siphon phenomenon and thermal/electric conduction in complex networks Journal Article uri icon

Overview

abstract

  • Abstract; In past decades, a lot of studies have been carried out on complex networks and heat conduction in regular lattices. However, very little attention has been paid to the heat conduction in complex networks. In this work, we study (both thermal and electric) energy transport in physical networks rewired from 2D regular lattices. It is found that the network can be transferred from a good conductor to a poor conductor, depending on the rewired network structure and coupling scheme. Two interesting phenomena were discovered: (i) the thermal-siphon effect—namely the heat flux can go from a low-temperature node to a higher-temperature node and (ii) there exits an optimal network structure that displays small thermal conductance and large electrical conductance. These discoveries reveal that network-structured materials have great potential in applications in thermal-energy management and thermal-electric-energy conversion.

publication date

  • February 1, 2020

has restriction

  • hybrid

Date in CU Experts

  • January 28, 2020 7:21 AM

Full Author List

  • Xiong K; Liu Z; Zeng C; Li B

author count

  • 4

Other Profiles

International Standard Serial Number (ISSN)

  • 2095-5138

Electronic International Standard Serial Number (EISSN)

  • 2053-714X

Additional Document Info

start page

  • 270

end page

  • 277

volume

  • 7

issue

  • 2