Dr. Lee's research activities include thermal management, 3-D packaging, self-aligning soldering, fluxless flip-chip connections, optoelectronics packaging, process control, microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS),and microfluidic devices. In particular, his recent research activities focus on: 1) flexible thermal ground planes for smartphones, tablets, laptops, AR/VR and wearable electronics; 2) micro cryogenic coolers for mobile sensors; and 3) microfluidic devices for culture, dose and lyse biological cells affected by molecules.
keywords
packaging for system integration, nanotechnology, microsystems, microelectromechanical systems, nanoelectromechanical systems, cryocoolers,thermal management, sensors, actuators, smartphones, microfluidic devices
MCEN 4010 - Microsystems Integration
Primary Instructor
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Spring 2019 / Spring 2020 / Spring 2021
A microsystem consists of microelectronic, optoelectronic, microwave, microelectromechanical and energy components interconnected. Thermal, electrical, fabrication and assembly issues for microsystems represented by iPhone series will be studied. The packaging and interconnection technologies used to establish the design and manufacturing infrastructure of microsystems will be reviewed. Other optoelectronic, MEMS and batter components for microsystems will also be studied. Same as MCEN 5010.
MCEN 4085 - Mechanical Engineering Design Project 2
Primary Instructor
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Spring 2018 / Spring 2019
Second part of a two-course capstone design experience in mechanical engineering. Includes refinement of prototype, design optimization, fabrication, testing, and evaluation. Students orally present the final design and prepare a written report and operation manual for the product. GEEN-BS and GEEN-BSEPL students are not required to complete MCEN 4026.
MCEN 5010 - Microsystems Integration
Primary Instructor
-
Spring 2019 / Spring 2020 / Spring 2021
A microsystem consists of microelectronic, optoelectronic, microwave, microelectromechanical and energy components interconnected. Thermal, electrical, fabrication and assembly issues for microsystems represented by iPhone series will be studied. The packaging and interconnection technologies used to establish the design and manufacturing infrastructure of microsystems will be reviewed. Other optoelectronic, MEMS and batter components for microsystems will also be studied. Same as MCEN 4010.
