Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays Journal Article uri icon

Overview

publication date

  • August 1, 2017

has restriction

  • hybrid

Date in CU Experts

  • July 25, 2017 4:41 AM

Full Author List

  • Wen R; Li Q; Wang W; Latour B; Li CH; Li C; Lee Y-C; Yang R

author count

  • 8

citation count

  • 196

Other Profiles

International Standard Serial Number (ISSN)

  • 2211-2855

Electronic International Standard Serial Number (EISSN)

  • 2211-3282

Additional Document Info

start page

  • 59

end page

  • 65

volume

  • 38