High stiffness - high damping chiral metamaterial assemblies for low-frequency applications Conference Proceeding
Overview
publication date
- March 11, 2013
has restriction
- closed
Date in CU Experts
- August 1, 2019 4:33 AM
Full Author List
- Baravelli E; Carrara M; Ruzzene M
Full Editor List
- Kundu T
author count
- 3
citation count
- 6
published in
- Proceedings of SPIE Journal
presented at event
Other Profiles
International Standard Serial Number (ISSN)
- 0277-786X
Electronic International Standard Serial Number (EISSN)
- 1996-756X
Digital Object Identifier (DOI)
Additional Document Info
volume
- 8695