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Mapping Three-Dimensional Micromechanics between Micro-Pillars and Soft Gel Substrates
Conference Proceeding
Overview
Overview
CU Boulder Authors
Rentschler, Mark
publication date
October 12, 2019
Date in CU Experts
January 3, 2020 12:53 PM
Full Author List
Rentschler M
author count
1
presented at event
Society of Engineering Science Technical Meeting
Conference