Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly Journal Article uri icon

Overview

publication date

  • October 1, 2011

Full Author List

  • Kong M; Jeon S; Au H; Hwang C; Lee Y-C

Other Profiles

Additional Document Info

start page

  • 1523

end page

  • 1532

volume

  • 1

issue

  • 10