STUDIES OF THERMOSONIC BONDING FOR FLIP-CHIP ASSEMBLY Journal Article uri icon

Overview

publication date

  • October 1, 1995

Full Author List

  • KANG SY; WILLIAMS PM; MCLAREN TS; LEE YC

Other Profiles

Additional Document Info

start page

  • 31

end page

  • 37

volume

  • 42

issue

  • 1