The effect of underfill epoxy on warpage in flip-chip assemblies Journal Article uri icon

Overview

publication date

  • June 1, 1998

Full Author List

  • Zhang WG; Wu D; Su BZ; Hareb SA; Lee YC; Masterson BP

Other Profiles

Additional Document Info

start page

  • 323

end page

  • 329

volume

  • 21

issue

  • 2