NDE of Additively Manufactured Parts via Directly Bonded and Mechanically Attached Electromechanical Impedance Sensors Conference Proceeding

Overview

CU Boulder Authors

Williams, Christopher

publication date

February 12, 2018

has restriction

closed

Date in CU Experts

February 14, 2024 9:13 AM

Full Author List

Tenney C; Albakri M; Williams CB; Tarazaga P

Full Editor List

Pakzad S

author count

4

citation count

5

published in

Conference Proceedings of the Society for Experimental Mechanics Series Journal

presented at event

36th International Modal Analysis Conference and Exposition (IMAC) on Structural Dynamics Conference

Other Profiles

International Standard Serial Number (ISSN)

2191-5644

Electronic International Standard Serial Number (EISSN)

2191-5652

Digital Object Identifier (DOI)

https://doi.org/10.1007/978-3-319-74421-6_35

International Standard Book Number (ISBN) 13

978-3-319-74420-9

Additional Document Info

start page

263

end page

271