Co-Simulation of PCB and Enclosure to Predict Radiated Emission Conference Proceeding

Best Open Access

Overview

CU Boulder Authors

Ding, Yifu

publication date

June 15, 2016

has restriction

gold

Date in CU Experts

January 19, 2025 8:19 AM

Full Author List

Ding Y; Zhang G; Zhang X; Wu Z

Full Editor List

Zhang D; Zi B; Cui G; Ding H

author count

4

citation count

0

published in

MATEC Web of Conferences Journal

presented at event

3rd International Conference on Mechanics and Mechatronics Research (ICMMR) Conference

Other Profiles

International Standard Serial Number (ISSN)

2261-236X

Digital Object Identifier (DOI)

https://doi.org/10.1051/matecconf/20167702003

Additional Document Info

volume

77