Multi-Layer Polymer-on-Si Interconnects for Heterogeneous Integration to 50-GHz
Journal Article
Overview
publication date
- January 1, 2026
Date in CU Experts
- February 27, 2026 3:55 AM
Full Author List
- Mvokany S; Molles JA; Verhaverbeke S; Chen H-W; Chen S; Ketterson A; Popović Z
author count
- 7
published in
- IEEE Journal of Microwaves Journal
Other Profiles
Electronic International Standard Serial Number (EISSN)
- 2692-8388
Digital Object Identifier (DOI)
Additional Document Info
start page
- 1
end page
- 14