Microelectromechanical Systems and Packaging Chapter uri icon



  • This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make ...

publication date

  • December 17, 2008

Date in CU Experts

  • December 17, 2013 12:56 PM

Full Author List

  • lee Y

Full Editor List

  • Lu D; Wong CP

author count

  • 1

Other Profiles

International Standard Book Number (ISBN) 10

  • 0387782192

International Standard Book Number (ISBN) 13

  • 9780387782195