Microelectromechanical Systems and Packaging Chapter uri icon

Overview

abstract

  • This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make ...

publication date

  • December 17, 2008

Full Author List

  • lee Y

book title

  • Materials for Advanced Packaging

Other Profiles

International Standard Book Number (ISBN) 13

  • 9780387782195