Development of a Thermosonic Bonding Process for an 8 x 8 VCSEL Array Based Optical Transceiver Chapter uri icon

Overview

abstract

  • This incomparable text features contributions from hands-on practitioners and, supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifier packaging * Discusses waveguide technologies, free ...

publication date

  • May 5, 1997

Full Author List

  • LEE Y

book title

  • Optoelectronic Packaging

Other Profiles

International Standard Book Number (ISBN) 13

  • 9780471111887