Flip-chip Assembly for Smart Pixel Arrays Chapter uri icon



  • This incomparable text features contributions from hands-on practitioners and, supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifier packaging * Discusses waveguide technologies, free ...

publication date

  • May 5, 1997

Full Author List

  • LEE Y

book title

  • Optoelectronic Packaging

Other Profiles

International Standard Book Number (ISBN) 13

  • 9780471111887