Atomic Layer Deposition/Molecular Layer Deposition for Packaging and Interconnect of N/MEMS Conference Proceeding

Overview

CU Boulder Authors

Lee, Y. C.

publication date

January 24, 2011

has restriction

closed

Date in CU Experts

May 28, 2014 4:03 AM

Full Author List

Lee YC

Full Editor List

GarciaBlanco S; Ramesham R

author count

1

citation count

2

published in

Proceedings of SPIE

presented at event

Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X Conference

Other Profiles

International Standard Serial Number (ISSN)

0277-786X

Electronic International Standard Serial Number (EISSN)

1996-756X

Digital Object Identifier (DOI)

https://doi.org/10.1117/12.877110

Additional Document Info

volume

7928