EFFECTS OF CERAMIC BALL-GRID-ARRAY PACKAGE MANUFACTURING VARIATIONS ON SOLDER JOINT RELIABILITY
Conference Proceeding
Overview
publication date
- April 13, 1994
Date in CU Experts
- May 28, 2014 4:03 AM
Full Author List
- JU TH; LEE YC
author count
- 2
citation count
- 2
presented at event
Other Profiles
International Standard Book Number (ISBN) 10
- 0-930815-39-4
Additional Document Info
start page
- 514
end page
- 519
volume
- 2256