Thermal and structural analysis of a suspended physics package for a chip-scale atomic clock Conference Proceeding uri icon

Overview

publication date

  • July 8, 2007

Full Author List

  • Laws AD; Lee YC

Other Profiles

International Standard Book Number (ISBN) 13

  • 978-0-7918-4277-5

Additional Document Info

start page

  • 953

end page

  • 962