Prediction of yield for flip-chip solder assemblies Conference Proceeding uri icon

Overview

publication date

  • April 15, 1998

Date in CU Experts

  • May 28, 2014 4:03 AM

Full Author List

  • Tower S; Si BZ; Lee YC

author count

  • 3

Other Profiles

International Standard Book Number (ISBN) 10

  • 0-7803-4850-8

Additional Document Info

start page

  • 35

end page

  • 40