Study of RF flip-chip assembly with underfill epoxy Conference Proceeding

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• April 15, 1998

has restriction

• closed

Date in CU Experts

• May 28, 2014 4:03 AM

Full Author List

• Zhang WG; Su BZ; Feng ZP; Gupta KC; Lee YC

author count

• 5

citation count

• 2

presented at event

• 1998 International Conference on Multichip Modules and High Density Packaging (MCM 98)  Conference

Other Profiles

Digital Object Identifier (DOI)

• https://doi.org/10.1109/icmcm.1998.670754

International Standard Book Number (ISBN) 10

• 0-7803-4850-8

Additional Document Info

start page

• 53

end page

• 57