Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate Journal Article
Overview
publication date
- March 1, 2009
Date in CU Experts
- January 20, 2017 1:02 AM
Full Author List
- Ding X; Geng F; Luo L
author count
- 3
citation count
- 11
published in
Other Profiles
International Standard Serial Number (ISSN)
- 0167-9317
Digital Object Identifier (DOI)
Additional Document Info
start page
- 335
end page
- 339
volume
- 86
issue
- 3