Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate Journal Article uri icon

Overview

publication date

  • March 1, 2009

Date in CU Experts

  • January 20, 2017 1:02 AM

Full Author List

  • Ding X; Geng F; Luo L

author count

  • 3

citation count

  • 11

Other Profiles

International Standard Serial Number (ISSN)

  • 0167-9317

Additional Document Info

start page

  • 335

end page

  • 339

volume

  • 86

issue

  • 3