Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate Journal Article uri icon

Overview

publication date

  • March 1, 2009

Full Author List

  • Ding X; Geng F; Luo L

Other Profiles

Additional Document Info

start page

  • 335

end page

  • 339

volume

  • 86

issue

  • 3