Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP Journal Article uri icon

Overview

publication date

  • January 1, 2012

Full Author List

  • Tang J; Ding X; Geng F; Sun X; Luo L

Other Profiles

Additional Document Info

start page

  • 119

end page

  • 126

volume

  • 18

issue

  • 1