A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication Journal Article uri icon

Overview

publication date

  • October 1, 2009

Full Author List

  • Fei G; Xiaoyun D; Gaowei X; Le L

Other Profiles

Additional Document Info

start page

  • 106003

end page

  • 106003

volume

  • 30

issue

  • 10