Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology Journal Article

Overview

CU Boulder Authors

Lee, Y. C.

publication date

March 1, 2017

has restriction

closed

Date in CU Experts

February 7, 2017 9:33 AM

Full Author List

Liew L-A; Lin C-Y; Lewis R; Song S; Li Q; Yang R; Lee YC

author count

7

citation count

20

published in

Journal of Electronic Packaging Journal

Other Profiles

International Standard Serial Number (ISSN)

1043-7398

Electronic International Standard Serial Number (EISSN)

1528-9044

Digital Object Identifier (DOI)

https://doi.org/10.1115/1.4035241

Additional Document Info

volume

139

issue

1

number

ARTN 011003