publication venue for Design of Thermal Ground Planes for Cooling of Foldable Smartphones 2019 Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers 2019 Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications 2017 Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology 2017 Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone 2016 Stretchable Thin Film Materials: Fabrication, Application, and Mechanics 2016 Special Section on InterPACK 2013 2014 Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly 2012 Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock 2009 Thermal conduction switch for thermal management of chip scale atomic clocks (IMECE2006-14540) 2008 Die cracking at solder (NO-PNO) joints on brittle (GaAs) chips: Fracture correlation using critical bimaterial interface corner stress intensities 2003 Reliability modeling for ball grid array assembly with a large number of warpage affected solder joints 2002 Random change of vibration modes in thermosonic bonding 1998 Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability 1994 Study of an Air Cooling Scheme for 3-D Packaging 1994 Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint 1991 Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging 1991