publication venue for
- Design of Thermal Ground Planes for Cooling of Foldable Smartphones 2019
- Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers 2019
- Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications 2017
- Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology 2017
- Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials 2016
- Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone 2016
- Stretchable Thin Film Materials: Fabrication, Application, and Mechanics 2016
- Special Section on InterPACK 2013 2014
- Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly 2012
- Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock 2009
- Thermal conduction switch for thermal management of chip scale atomic clocks (IMECE2006-14540) 2008
- Die cracking at solder (NO-PNO) joints on brittle (GaAs) chips: Fracture correlation using critical bimaterial interface corner stress intensities 2003
- Reliability modeling for ball grid array assembly with a large number of warpage affected solder joints 2002
- Random change of vibration modes in thermosonic bonding 1998
- Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability 1994
- Study of an Air Cooling Scheme for 3-D Packaging 1994
- Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint 1991
- Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging 1991