EFFECT OF INTERFACIAL LAYERS ON THE PERFORMANCE OF Cu-In LIQUID PHASE SINTERED COMPOSITES AS THERMAL INTERFACE AND INTERCONNECT MATERIALS Conference Proceeding uri icon

Overview

publication date

  • July 6, 2011

Full Author List

  • Liu J; Kumar P; Dutta I; Nagaraj CM; Raj R; Renavikar M; Mahajan R

Other Profiles

International Standard Book Number (ISBN) 13

  • 978-0-7918-4462-5

Additional Document Info

start page

  • 773

end page

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