Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements Journal Article uri icon

Overview

publication date

  • May 1, 2011

has restriction

  • closed

Date in CU Experts

  • December 18, 2018 4:31 AM

Full Author List

  • Wojcik H; Merkel U; Jahn A; Richter K; Junige M; Klein C; Gluch J; Albert M; Munnik F; Wenzel C

author count

  • 11

citation count

  • 9

Other Profiles

International Standard Serial Number (ISSN)

  • 0167-9317

Electronic International Standard Serial Number (EISSN)

  • 1873-5568

Additional Document Info

start page

  • 641

end page

  • 645

volume

  • 88

issue

  • 5