Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics Conference Proceeding uri icon

Overview

publication date

  • May 29, 2018

has restriction

  • closed

Date in CU Experts

  • February 4, 2019 11:26 AM

Full Author List

  • Xu S; Lewis RJ; Wen R; Yang R; Lee Y-CYC; Kim W; Nguyen L

author count

  • 7

citation count

  • 3

Other Profiles

International Standard Serial Number (ISSN)

  • 0569-5503

Electronic International Standard Serial Number (EISSN)

  • 2377-5726

Additional Document Info

start page

  • 2248

end page

  • 2253