Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics Conference Proceeding

Overview

CU Boulder Authors

publication date

May 29, 2018

Full Author List

Xu S; Lewis RJ; Wen R; Yang R; Lee Y-CYC; Kim W; Nguyen L

published in

Electronic Components and Technology Conference Journal

Other Profiles

Digital Object Identifier (DOI)

10.1109/ECTC.2018.00338

Additional Document Info

start page

2248

end page

2253