Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics Conference Proceeding uri icon

Overview

publication date

  • May 29, 2018

Full Author List

  • Xu S; Lewis RJ; Wen R; Yang R; Lee Y-CYC; Kim W; Nguyen L

Other Profiles

Additional Document Info

start page

  • 2248

end page

  • 2253