3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating Journal Article uri icon

Overview

publication date

  • January 15, 2019

has restriction

  • closed

Date in CU Experts

  • February 20, 2019 3:18 AM

Full Author List

  • Kilige S; Bartusseck I; Junige M; Neumann V; Reif J; Wenzel C; Boettcher M; Albert M; Wolf MJ; Bartha JW

author count

  • 10

citation count

  • 12

Other Profiles

International Standard Serial Number (ISSN)

  • 0167-9317

Electronic International Standard Serial Number (EISSN)

  • 1873-5568

Additional Document Info

start page

  • 20

end page

  • 25

volume

  • 205