Solder-assembled large MEMS flaps for fluid mixing Journal Article

Overview

CU Boulder Authors

• Bradley, Liz
• Hertzberg, Jean R
• Lee, Y. C.

publication date

• August 1, 2003

has restriction

• closed

Date in CU Experts

• September 6, 2013 12:21 PM

Full Author List

• Ma ZC; Bradley E; Peacock T; Hertzberg JR; Lee YC

author count

• 5

citation count

• 4

published in

• IEEE Transactions on Advanced Packaging  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 1521-3323

Digital Object Identifier (DOI)

• https://doi.org/10.1109/tadvp.2003.817966

Additional Document Info

start page

• 268

end page

• 276

volume

• 26

issue

• 3