publication venue for Special Section on Packaging for Micro/Nano-Scale Systems Foreword 2009 Flip-chip-assembled air-suspended inductors 2007 Special Section On Micro- And Nanoscale Packaging - Foreword 2005 Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology 2003 Foreword - Special issue on MEMS/NEMS packaging 2003 Packaging for microelectromechanical and nanoelectromechanical systems 2003 Solder-assembled large MEMS flaps for fluid mixing 2003 Thermal analysis of micromirrors for high-energy applications 2003 An embedded overlay concept for microsystems packaging 2000 Modeling and evaluation criterion for thermocompression flip-chip bonding 2000 Study of fluxless soldering using formic acid vapor 1999 Thermosonic flip-chip bonding system with a self-planarization feature using polymer 1999 Numerical modeling of a clock distribution network for a superconducting multichip module 1998 Thermosonic flip-chip bonding using longitudinal ultrasonic vibration 1998 Thermosonic bonding of an optical transceiver based ore an 8x8 vertical cavity surface emitting laser array 1997 Thermal management of VCSEL-based optoelectronic modules 1996 MODELING AND EXPERIMENTAL STUDIES ON THERMOSONIC FLIP-CHIP BONDING 1995 DESIGN OF SOLDER JOINTS FOR SELF-ALIGNED OPTOELECTRONIC ASSEMBLIES 1995