keywords
- 0906 Electrical and Electronic Engineering, 0910 Manufacturing Engineering
IEEE Transactions on Advanced Packaging
Journal
Research
Other
publication venue for
- Special Section on Packaging for Micro/Nano-Scale Systems Foreword 2009
- Flip-chip-assembled air-suspended inductors 2007
- Special Section On Micro- And Nanoscale Packaging - Foreword 2005
- Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology 2003
- Foreword - Special issue on MEMS/NEMS packaging 2003
- Packaging for microelectromechanical and nanoelectromechanical systems 2003
- Solder-assembled large MEMS flaps for fluid mixing 2003
- Thermal analysis of micromirrors for high-energy applications 2003
- An embedded overlay concept for microsystems packaging 2000
- Modeling and evaluation criterion for thermocompression flip-chip bonding 2000
- Study of fluxless soldering using formic acid vapor 1999
- Thermosonic flip-chip bonding system with a self-planarization feature using polymer 1999
- Numerical modeling of a clock distribution network for a superconducting multichip module 1998
- Thermosonic flip-chip bonding using longitudinal ultrasonic vibration 1998
- Thermosonic bonding of an optical transceiver based ore an 8x8 vertical cavity surface emitting laser array 1997
- Thermal management of VCSEL-based optoelectronic modules 1996
- MODELING AND EXPERIMENTAL STUDIES ON THERMOSONIC FLIP-CHIP BONDING 1995
- DESIGN OF SOLDER JOINTS FOR SELF-ALIGNED OPTOELECTRONIC ASSEMBLIES 1995