IEEE Transactions on Advanced Packaging Journal

Overview

publication venue for

• Special Section on Packaging for Micro/Nano-Scale Systems Foreword 2009
• Flip-chip-assembled air-suspended inductors 2007
• Special Section On Micro- And Nanoscale Packaging - Foreword 2005
• Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology 2003
• Foreword - Special issue on MEMS/NEMS packaging 2003
Packaging for microelectromechanical and nanoelectromechanical systems 2003
Solder-assembled large MEMS flaps for fluid mixing 2003
Thermal analysis of micromirrors for high-energy applications 2003
An embedded overlay concept for microsystems packaging 2000
Modeling and evaluation criterion for thermocompression flip-chip bonding 2000
Study of fluxless soldering using formic acid vapor 1999
Thermosonic flip-chip bonding system with a self-planarization feature using polymer 1999
Numerical modeling of a clock distribution network for a superconducting multichip module 1998
Thermosonic flip-chip bonding using longitudinal ultrasonic vibration 1998
Thermosonic bonding of an optical transceiver based ore an 8x8 vertical cavity surface emitting laser array 1997
Thermal management of VCSEL-based optoelectronic modules 1996
MODELING AND EXPERIMENTAL STUDIES ON THERMOSONIC FLIP-CHIP BONDING 1995
DESIGN OF SOLDER JOINTS FOR SELF-ALIGNED OPTOELECTRONIC ASSEMBLIES 1995
... more

Research

keywords

• 0906 Electrical and Electronic Engineering, 0910 Manufacturing Engineering