keywords
- 0906 Electrical and Electronic Engineering, 0910 Manufacturing Engineering
IEEE Transactions on Advanced Packaging
Journal
Research
Other
publication venue for
- Flip-chip-assembled air-suspended inductors 2007
- Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology 2003
- Solder-assembled large MEMS flaps for fluid mixing 2003
- Thermal analysis of micromirrors for high-energy applications 2003
- An embedded overlay concept for microsystems packaging 2000
- Numerical modeling of a clock distribution network for a superconducting multichip module 1998