Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly Journal Article

Overview

CU Boulder Authors

Lee, Y. C.

publication date

June 1, 2012

has restriction

closed

Date in CU Experts

September 6, 2013 12:40 PM

Full Author List

Kong M; Jeon S; Hwang C; Lee YC

author count

4

citation count

3

published in

Journal of Electronic Packaging Journal

Other Profiles

International Standard Serial Number (ISSN)

1043-7398

Electronic International Standard Serial Number (EISSN)

1528-9044

Digital Object Identifier (DOI)

https://doi.org/10.1115/1.4006513

Additional Document Info

volume

134

issue

2

number

ARTN 021002