Thermosonic flip-chip bonding system with a self-planarization feature using polymer Journal Article uri icon

Overview

publication date

  • August 1, 1999

Full Author List

  • Tan Q; Schaible B; Bond LJ; Lee YC

Other Profiles

Additional Document Info

start page

  • 468

end page

  • 475

volume

  • 22

issue

  • 3