Thermosonic flip-chip bonding system with a self-planarization feature using polymer Journal Article uri icon

Overview

publication date

  • August 1, 1999

has restriction

  • closed

Date in CU Experts

  • September 6, 2013 12:40 PM

Full Author List

  • Tan Q; Schaible B; Bond LJ; Lee YC

author count

  • 4

citation count

  • 22

Other Profiles

International Standard Serial Number (ISSN)

  • 1521-3323

Additional Document Info

start page

  • 468

end page

  • 475

volume

  • 22

issue

  • 3