Reliability modeling for ball grid array assembly with a large number of warpage affected solder joints Journal Article uri icon

Overview

publication date

  • September 1, 2002

has restriction

  • closed

Date in CU Experts

  • September 6, 2013 12:40 PM

Full Author List

  • Chan YW; Ju TH; Hareb SA; Lee YC; Wu JS; Lii MJ

author count

  • 6

citation count

  • 13

Other Profiles

International Standard Serial Number (ISSN)

  • 1043-7398

Electronic International Standard Serial Number (EISSN)

  • 1528-9044

Additional Document Info

start page

  • 246

end page

  • 253

volume

  • 124

issue

  • 3