Reliability modeling for ball grid array assembly with a large number of warpage affected solder joints Journal Article uri icon

Overview

publication date

  • September 1, 2002

Full Author List

  • Chan YW; Ju TH; Hareb SA; Lee YC; Wu JS; Lii MJ

Other Profiles

Additional Document Info

start page

  • 246

end page

  • 253

volume

  • 124

issue

  • 3