Modeling and evaluation criterion for thermocompression flip-chip bonding Journal Article uri icon

Overview

publication date

  • November 1, 2000

Date in CU Experts

  • September 6, 2013 12:40 PM

Full Author List

  • McLaren TS; Lee YC

author count

  • 2

citation count

  • 19

Other Profiles

International Standard Serial Number (ISSN)

  • 1521-3323

Additional Document Info

start page

  • 652

end page

  • 660

volume

  • 23

issue

  • 4