Thermal management of VCSEL-based optoelectronic modules Journal Article

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• August 1, 1996

has restriction

• closed

Date in CU Experts

• September 6, 2013 12:41 PM

Full Author List

• Lee YC; Swirhun SE; Fu WS; Keyser TA; Jewell JL; Quinn WE

author count

• 6

citation count

• 17

published in

• IEEE Transactions on Advanced Packaging  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 1070-9894

Digital Object Identifier (DOI)

• https://doi.org/10.1109/96.533893

Additional Document Info

start page

• 540

end page

• 547

volume

• 19

issue

• 3