Thermosonic flip-chip bonding using longitudinal ultrasonic vibration Journal Article uri icon

Overview

publication date

  • February 1, 1998

Date in CU Experts

  • September 6, 2013 12:41 PM

Full Author List

  • Tan Q; Zhang WG; Schaible B; Bond LJ; Ju TH; Lee YC

author count

  • 6

citation count

  • 36

Other Profiles

International Standard Serial Number (ISSN)

  • 1070-9894

Additional Document Info

start page

  • 53

end page

  • 58

volume

  • 21

issue

  • 1