Thermosonic flip-chip bonding using longitudinal ultrasonic vibration Journal Article uri icon

Overview

publication date

  • February 1, 1998

Full Author List

  • Tan Q; Zhang WG; Schaible B; Bond LJ; Ju TH; Lee YC

Additional Document Info

start page

  • 53

end page

  • 58

volume

  • 21

issue

  • 1