MODELING AND EXPERIMENTAL STUDIES ON THERMOSONIC FLIP-CHIP BONDING Journal Article uri icon

Overview

publication date

  • November 1, 1995

Date in CU Experts

  • September 6, 2013 12:41 PM

Full Author List

  • KANG SY; WILLIAMS PM; LEE YC

author count

  • 3

citation count

  • 45

Other Profiles

International Standard Serial Number (ISSN)

  • 1070-9894

Additional Document Info

start page

  • 728

end page

  • 733

volume

  • 18

issue

  • 4