MODELING AND EXPERIMENTAL STUDIES ON THERMOSONIC FLIP-CHIP BONDING Journal Article
Overview
publication date
- November 1, 1995
Date in CU Experts
- September 6, 2013 12:41 PM
Full Author List
- KANG SY; WILLIAMS PM; LEE YC
author count
- 3
citation count
- 45
published in
Other Profiles
International Standard Serial Number (ISSN)
- 1070-9894
Digital Object Identifier (DOI)
Additional Document Info
start page
- 728
end page
- 733
volume
- 18
issue
- 4