Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications Journal Article uri icon

Overview

publication date

  • November 1, 2011

Full Author List

  • Liu J; Kumar P; Dutta I; Raj R; Sidhu R; Renavikar M; Mahajan R

Other Profiles

Additional Document Info

start page

  • 7012

end page

  • 7025

volume

  • 46

issue

  • 21