Stress Evolution in Sn Thin Films During Thermal Cycling Conference Proceeding uri icon

Overview

publication date

  • February 8, 2009

Date in CU Experts

  • November 5, 2020 2:39 AM

Full Author List

  • Stevens KJ; Cheong KC; Cai Z; Ingham B; Toney MF

Full Editor List

  • Hendy SC; Brown IWM

author count

  • 5

Other Profiles

International Standard Serial Number (ISSN)

  • 0094-243X

International Standard Book Number (ISBN) 13

  • 978-0-7354-0688-9

Additional Document Info

start page

  • 141

end page

  • +

volume

  • 1151