Reversible Soft-Contact Lamination and Delamination for Non-Invasive Fabrication and Characterization of Bulk-Heterojunction and Bilayer Organic Solar Cells Journal Article uri icon

Overview

publication date

  • September 14, 2010

has restriction

  • closed

Date in CU Experts

  • November 5, 2020 2:40 AM

Full Author List

  • Kim JB; Lee S; Toney MF; Chen Z; Facchetti A; Kim YS; Loo Y-L

author count

  • 7

citation count

  • 40

Other Profiles

International Standard Serial Number (ISSN)

  • 0897-4756

Electronic International Standard Serial Number (EISSN)

  • 1520-5002

Additional Document Info

start page

  • 4931

end page

  • 4938

volume

  • 22

issue

  • 17