Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability Journal Article uri icon

Overview

publication date

  • January 1, 1994

Full Author List

  • Ju T-H; Lin W; Lee YC; Liu JJ

Other Profiles

Additional Document Info

start page

  • 242

end page

  • 242

volume

  • 116

issue

  • 4