Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint Journal Article uri icon

Overview

abstract

  • A three-dimensional mathematical model simulating the self-alignment mechanism in the flip-chip soldering of a single joint has been developed. Based on the principle of energy minimization, it calculates the quasi-static surface profiles defined by the size of the solder pads, the solder volume, the surface tension coefficient, the vertical loading and the misalignment. The model is capable of calculating initial, intermediate and final profiles and their associated restoring forces during the solder reflow. It can provide the guidelines to improve the assembly yield and the stress-related reliability of the flip-chip soldering technology.

publication date

  • December 1, 1991

Full Author List

  • Patra SK; Lee YC

Other Profiles

Additional Document Info

start page

  • 337

end page

  • 342

volume

  • 113

issue

  • 4