Thermosonic flip-chip bonding for an 8x8 VCSEL array Conference Proceeding uri icon

Overview

publication date

  • May 21, 1995

Full Author List

  • MCLAREN T; KANG SY; ZHANG WG; HELLMAN D; JU TH; LEE YC

Additional Document Info

start page

  • 393

end page

  • 400