THERMOSONIC FLIP-CHIP BONDING FOR AN 8X8 VCSEL ARRAY Conference Proceeding uri icon

Overview

publication date

  • May 21, 1995

Date in CU Experts

  • May 28, 2014 4:03 AM

Full Author List

  • MCLAREN T; KANG SY; ZHANG WG; HELLMAN D; JU TH; LEE YC

author count

  • 6

citation count

  • 5

Other Profiles

International Standard Serial Number (ISSN)

  • 0569-5503

Electronic International Standard Serial Number (EISSN)

  • 2377-5726

International Standard Book Number (ISBN) 10

  • 0-7803-2737-3

Additional Document Info

start page

  • 393

end page

  • 400