THERMOSONIC BONDING FOR FLIP-CHIP ASSEMBLY
Conference Proceeding
Overview
publication date
- January 31, 1995
Date in CU Experts
- May 28, 2014 4:03 AM
Full Author List
- KANG SY; MCLAREN T; ZHANG WG; LEE YC
author count
- 4
presented at event
- 1995 IEEE Multi-Chip Module Conference Conference
Other Profiles
International Standard Book Number (ISBN) 10
- 0-8186-6970-5
Additional Document Info
start page
- 75
end page
- 80