ALD-Enabled Hermetic Sealing for Polymer-Based Wafer Level Packaging of MEMS Conference Proceeding

Overview

CU Boulder Authors

Lee, Y. C.

publication date

January 24, 2010

Date in CU Experts

May 28, 2014 4:03 AM

Full Author List

Lin C; Zhang Y; Abdulagatov A; Yang R; George S; Lee YC

author count

6

citation count

2

published in

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Journal

presented at event

23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Conference

Other Profiles

International Standard Serial Number (ISSN)

1084-6999

Additional Document Info

start page

528

end page

531