ALD-Enabled Hermetic Sealing for Polymer-Based Wafer Level Packaging of MEMS Conference Proceeding

Overview

CU Boulder Authors

Lee, Y. C.

publication date

January 24, 2010

Full Author List

Lin C; Zhang Y; Abdulagatov A; Yang R; George S; Lee YC

published in

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Journal

Additional Document Info

start page

528

end page

531