TiN coating - A solution for high temperature interconnects Conference Proceeding

Overview

CU Boulder Authors

Raj, Rishi

publication date

September 4, 2002

Date in CU Experts

May 28, 2014 4:47 AM

Full Author List

Ryu HY; Saravanan RA; Raj R

author count

3

published in

Proceedings of SPIE Journal

presented at event

International Symposium on Microelectronics Conference

Other Profiles

International Standard Serial Number (ISSN)

0277-786X

International Standard Book Number (ISBN) 10

0-8194-4726-9

Additional Document Info

start page

490

end page

493

volume

4931