Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications Journal Article uri icon

Overview

publication date

  • November 1, 2014

Full Author List

  • Liu J; Sahaym U; Dutta I; Raj R; Renavikar M; Sidhu RS; Mahajan R

Other Profiles

Additional Document Info

start page

  • 7844

end page

  • 7854

volume

  • 49

issue

  • 22