Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications Journal Article
Overview
publication date
- November 1, 2014
has restriction
- closed
Date in CU Experts
- November 6, 2014 7:17 AM
Full Author List
- Liu J; Sahaym U; Dutta I; Raj R; Renavikar M; Sidhu RS; Mahajan R
author count
- 7
citation count
- 15
published in
Other Profiles
International Standard Serial Number (ISSN)
- 0022-2461
Electronic International Standard Serial Number (EISSN)
- 1573-4803
Digital Object Identifier (DOI)
Additional Document Info
start page
- 7844
end page
- 7854
volume
- 49
issue
- 22