Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications Journal Article uri icon

Overview

publication date

  • November 1, 2014

has restriction

  • closed

Date in CU Experts

  • November 6, 2014 7:17 AM

Full Author List

  • Liu J; Sahaym U; Dutta I; Raj R; Renavikar M; Sidhu RS; Mahajan R

author count

  • 7

citation count

  • 15

Other Profiles

International Standard Serial Number (ISSN)

  • 0022-2461

Electronic International Standard Serial Number (EISSN)

  • 1573-4803

Additional Document Info

start page

  • 7844

end page

  • 7854

volume

  • 49

issue

  • 22