Special Section on InterPACK 2013 Journal Article

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• December 1, 2014

Date in CU Experts

• December 15, 2014 8:54 AM

Full Author List

• Chaparala S; Gupta A; Hoivik N; Lee YC

author count

• 4

published in

• Journal of Electronic Packaging  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 1043-7398

Electronic International Standard Serial Number (EISSN)

• 1528-9044

Additional Document Info

volume

• 136

issue

• 4